您現(xiàn)在位置：首頁 > 產(chǎn)品中心 >Logitech精密材料表面處理>
| 產(chǎn)品圖片 | 產(chǎn)品名稱/型號(hào) | 產(chǎn)品描述 |
-
The GI20 grazing incidence interferometer provides high precision flatness measurement, suitable for use with lapped and semi-polished surfaces up to 150mm （6”）Ø. -
The Logitech CG-10 Precision Electronic Measurement System is a compact gauging instrument, suitable for most linear dimensional measurement applications. It offers a high degree of accuracy over .... -
The CB30 Bonding Unit and CH30 Hotplate compliment the Compact 50 Thin Section Preparation System. The bonding unit and hotplate are ideal for research or education purposes. -
The production of thin and ultra thin sections of materials requires the sample material to be fixed to a substrate （e.g. glass microscope slide） for support during processing. -
For easily achievable impregnation results, the CitoVac provides superior capabilities and trouble-free operation. Its spacious vacuum chamber and clear, user-friendly display offers great ease of use -
The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm
